GLASS SUBSTRATE AND METHOD FOR MANUFACTURING SAME

WIPO Patent Application WO/2010/104039

A1

Provided is a glass substrate (1) having the front surface (2a), the rear surface (2b), and the edge surface (3b) between the outer circumferential ends of the both surfaces (2a, 2b). A chamfered surface (4) is formed on the boundary section between the front surface (2a) and/or the rear surface (2b) and the edge surface (3b), the ten-point average roughness (Rz2) of the chamfered surface (4) is smaller than the ten-point average roughness (Rz1) of the edge surface (3b), and the average length (RSm2) of the roughness curve elements of the chamfered surface (4) is longer than the average length (RSm1) of the roughness curve elements of the edge surface. Preferably, the ten-point average roughness (Rz2) of the chamfered surface (4) and the ten-point average roughness (Rz1) of the edge surface (3b) satisfy the inequalities of Rz1≤1.5 and 1.5≤Rz1/Rz2≤10.0.

JPS5915785	[Title of the Invention] Conveyance side Collector of cylindrical material
JPH08267347	MIRROR SURFACE POLISHING METHOD OF WAFER CHAMFER WITH ORIENTATION FLAT
JP5046775	Polishing equipment

SHIMOTSU KOICHI (JP)
NAKATSU HIROYUKI (JP)
MINARI TAIKI (JP)
TAKAHASHI YUJI (JP)
ETA MICHIHARU (JP)
AIBA HISATOSHI (JP)

PCT/JP2010/053800

September 16, 2010

March 08, 2010

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NIPPON ELECTRIC GLASS CO (JP)
SHIMOTSU KOICHI (JP)
NAKATSU HIROYUKI (JP)
MINARI TAIKI (JP)
TAKAHASHI YUJI (JP)
ETA MICHIHARU (JP)
AIBA HISATOSHI (JP)

B24B9/00; C03C19/00; G02F1/1333; H01J9/24; H01J17/16

WO2009084683A1

2009-07-09

JP2009099250A	2009-05-07
JP2009134802A	2009-06-18
JP2008119801A	2008-05-29

TANAKA Hideyoshi et al. (JP)
Hideyoshi Tanaka (JP)

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