Title:
GLASS SUBSTRATE PACKAGING METHOD, GLASS MATERIAL AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/149485
Kind Code:
A1
Abstract:
A glass substrate packaging method, a glass material and an electronic device relate to the technical field of sensitivity electronic component packaging. The packaging method comprises: glass cement is covered the packaging area on a first glass substrate (1), the glass cement containing a carbon nano-tube; a second glass substrate (2) and the first glass substrate (1) are arranged in a pressing-fit mode, a laser is used for irradiating the packaging area, and the first glass substrate (1) and the second glass substrate (2) are melted and sintered in the packaging area. The absorbing capability of the glass cement to the laser can be improved, the laser power needed in the packaging process can be reduced, and accordingly the risk that the glass substrates are cracked is reduced.
Inventors:
WANG DAN (CN)
Application Number:
PCT/CN2014/086893
Publication Date:
October 08, 2015
Filing Date:
September 19, 2014
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
H01L51/56; H01L51/52; H01L51/54
Foreign References:
| CN103928638A | 2014-07-16 | |||
| CN101009300A | 2007-08-01 | |||
| CN102005443A | 2011-04-06 | |||
| CN102331642A | 2012-01-25 |
Attorney, Agent or Firm:
DRAGON INTELLECTUAL PROPERTY LAW FIRM (CN)
北京银龙知识产权代理有限公司 (CN)
北京银龙知识产权代理有限公司 (CN)
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