Title:
GLASS SUBSTRATE, SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/025883
Kind Code:
A1
Abstract:
This glass substrate has a compaction of 0.1-100 ppm, wherein the absolute value |Δα50/100| of the difference between an average thermal expansion coefficient of monocrystalline silicon and an average thermal expansion coefficient α50/100 of the glass substrate at 50-100°C, the absolute value |Δα100/200| of the difference between an average thermal expansion coefficient of monocrystalline silicon and an average thermal expansion coefficient α100/200 of the glass substrate at 100-200°C, and the absolute value |Δα200/300| of the difference between an average thermal expansion coefficient of monocrystalline silicon and an average thermal expansion coefficient α200/300 of the glass substrate at 200-300°C at 200-300°C, are all 0.16 ppm/°C or less.
Inventors:
NOMURA SHUHEI (JP)
ONO KAZUTAKA (JP)
ONO KAZUTAKA (JP)
Application Number:
PCT/JP2017/027949
Publication Date:
February 08, 2018
Filing Date:
August 01, 2017
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
C03C3/083; C03C3/085; C03C3/087; C03C3/091; G02F1/1333; H01L21/02; H01L21/336; H01L27/12; H01L29/786
Domestic Patent References:
| WO2016063981A1 | 2016-04-28 | |||
| WO2012132328A1 | 2012-10-04 |
Foreign References:
| JP2012123405A | 2012-06-28 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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