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Patent Searching and Data


Title:
GLASS WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/244687
Kind Code:
A1
Abstract:
In order to provide a glass wiring board which is capable of suppressing the occurrence of a crack by preventing concentration of stress on a glass plate that is provided with a conductor layer containing an electrolytic copper plating layer, a wiring board according to the present invention comprises a glass plate 10, a first metal layer 60 that covers at least a part of the glass plate 10, and a second metal layer 70 that covers at least a part of the first metal layer 60, with the area of the first metal layer 60 in contact with the second metal layer 70 being smaller than the area of the second metal layer 70 facing the first metal layer 60.

Inventors:
TSUCHIDA TETSUYUKI (JP)
Application Number:
JP2019/022857
Publication Date:
December 26, 2019
Filing Date:
June 10, 2019
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD (JP)
International Classes:
H01L23/15; C03C17/36; C23C18/34; C25D7/00; H05K1/02; H05K1/03; H05K1/09
Foreign References:
JP2018093141A2018-06-14
JP2017212271A2017-11-30
JP2018107256A2018-07-05
Attorney, Agent or Firm:
PATENT CORPORATE BODY DAI-ICHI KOKUSAI TOKKYO JIMUSHO (JP)
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