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Patent Searching and Data


Title:
GLASS WIRING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/117073
Kind Code:
A1
Abstract:
The present invention provides a glass wiring substrate in which an analog splitter comprising a capacitor and an inductor is formed on a glass substrate having a small thickness to prevent glass from being broken during manufacturing so as to stabilize the electrical characteristics of the analog splitter, wherein the glass substrate is used as a core substrate. According to the present invention, an inductor (5) is formed by using a through-electrode (3) which contacts an inorganic adherence layer (2) in a glass substrate (10) on which the inorganic adherence layer (2) is formed, a capacitor (11) is formed by using an insulating resin opening part (7) formed in an insulating resin layer (6) coated on the glass substrate (10) having an electric wire, and the inductor (5) and the capacitor (11) are formed on different layers.

Inventors:
FUJITA TAKASHI (JP)
Application Number:
JP2018/045272
Publication Date:
June 20, 2019
Filing Date:
December 10, 2018
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD (JP)
International Classes:
H05K3/46; H01F27/00; H01G4/40; H01L23/12; H03H7/00; H05K3/42
Foreign References:
JP2009518953A2009-05-07
JP2016502261A2016-01-21
JPH11150373A1999-06-02
JP2001126946A2001-05-11
JP2017073424A2017-04-13
Attorney, Agent or Firm:
HIROSE Hajime et al. (Postcode1056032, JP)
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