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Patent Searching and Data


Title:
GLUTEN FREE AND DIABETIC WAFER
Document Type and Number:
WIPO Patent Application WO/2018/217177
Kind Code:
A1
Abstract:
The invention relates to a wafer composition containing both gluten-free and diabetic properties, the resulting sugar void and the void formed by the gluten removed in the making of the waffle sheet are filled with fiber reinforcement and thus separated from the similar products.

Inventors:
SERİN, Abdullah (Necmettin Erbakan Ünv. Mühendislik Fak. Gıda Mühendisliği Bölümü, Konya, TR)
Application Number:
TR2017/050438
Publication Date:
November 29, 2018
Filing Date:
September 21, 2017
Export Citation:
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Assignee:
SERİN, Abdullah (Necmettin Erbakan Ünv. Mühendislik Fak. Gıda Mühendisliği Bölümü, Konya, TR)
International Classes:
A21D13/066; A21D2/18; A21D2/36; A21D13/45
Foreign References:
RU2528463C12014-09-20
US20020039612A12002-04-04
US20140030376A12014-01-30
US20120121758A12012-05-17
CA2744122A12007-06-21
US20090081335A12009-03-26
US20140044839A12014-02-13
Other References:
None
Attorney, Agent or Firm:
AKKAŞ, Ahmet (Ferhuniye Mh. Ulaşbaba Cad. Aras İş Mrk. No:15/10, Konya, TR)
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Claims:
CLAIMS

1 . A gluten free and diabetic wafer characterized in that by comprising at least one of the following flour types; quinoa, lupine, teff, taro flour, amarant, chickpea flour, corn flour, lentil flour, sweet potato flour, soybean flour, millet and sorghum flour, at least one of the coconut oil and cocoa butter, at least one of the following sweeteners; aspartam, sorbitol, mannitol, saccharin, cyclamate and stevia, at least one of the resistant maltodextrins, galacto- saccharides, cellulose, hemicelluloses, hemiglucans, pectins, mucilages, oligosaccharides (inulin), β-glucan and lignin and a vitamin and mineral added cream.

2. The gluten free and diabetic wafer mentioned in Claim 1 characterized in that by comprising at least one of the cinnamon, clove, ginger, blueberry, flaxseed, turmeric, cardamom, mahalep spices

Description:
GLUTEN FREE AND DIABETIC WAFER

TECHNICAL FIELD

The invention relates to a wafer composition containing both gluten-free and diabetic properties, the resulting sugar void and the void formed by the gluten removed in the making of the waffle sheet are filled with fiber reinforcement and thus separated from the similar products. PRIOR ART

The currently produced diabetic wafers are made from wheat flour and therefore contain gluten. For this reason, it is not possible for celiac patients to use diabetes products. This means that a person with both diabetes and celiac disease cannot consume these products. However, since starch is used in most of the products produced for celiac patients, it increases the risk of sugar release and diabetes. In addition, aroma is used in the wafer technology and the real fruit extract is not used completely but it is supported with aroma only.

In our country, the rate of incidence of diabetes is around 5%, and the celiac disease is 1 %. The products that need to be used in these diseases, which are increasing in number of patients, are very expensive, and from our country's point of view, most of the market is welcomed with imported products

BRIEF DESCRIPTION OF THE INVENTION

The invention is both a gluten-free and diabetic product and gluten-free flour is selected for the waffle leaf. These selected flours have low glycemic index. In addition, food fibers have been added to these flours.

30% of the total amount of flour in the waffle leaf consists of fiber. The flour to be used is chosen from at least one of the following types of flours: quinoa, lupine, teff, taro flour, amarant, chickpea flour, corn flour, lentil flour, sweet potato flour, soybean flour, millet and sorghum flour. Innovation is being created without the use of widely used starches in existing gluten-free flours. The formulation for leaf flour is determined as at least one of the following types of flours; quinoa, lupine, teff, taro flour, amarant, chickpea flour, corn flour, lentil flour, sweet potato flour, soybean flour, millet and sorghum flour in the amount of %97, %1 amount of modified corn flour (corn suprex) and/or %1 -2 amount of gum, and %1 amount of E472e Mono- and di-glycerides diacetyltartaric acid esters.

DETAILED DESCRIPTION OF THE INVENTION

A normal wafer cream contains 30% sugar, 30% starch, and 30% vegetable palm oil. In the remaining 10% milk powder and / or cocoa are present. Novelties in our invention are at least one of the coconut oil and cocoa butter are preferred instead of palm oil, at least one of the following sweeteners is used instead of sugar; aspartam, sorbitol, mannitol, saccharin, cyclamate and stevia and complementing the void resulting from reduced usage of sweeteners with food fiber and resistant starches (at least one of the resistant maltodextrins, galacto-saccharides, cellulose, hemicelluloses, hemiglucans, pectins, mucilages, oligosaccharides (inulin), β-glucan and lignin) because of being about 300-400 times more sweet than the sugar. Resistant starches are also used as fat substitutes. For this reason, the harmful effects of oil is reduced by reducing the amount of oil to be used in the cream. In addition, unlike the known technology, vitamins and minerals are added to the cream. This makes the invention more useful for patients with insufficient nourishing celiac and diabetes.

The fiber content of the final product is 30%. Considering the normal weight of wafers, this figure stands out as 12 gr fiber. Therefore, it is possible to meet half of the daily fiber requirement of an adult individual by consuming the waffle mentioned in our invention of 1 slice per day. 30% of the total amount of flour in the wafer leaf consists of fiber. The flour to be used is at least one of the following flour types; quinoa, lupine, teff, taro flour, amarant, chickpea flour, corn flour, lentil flour, sweet potato flour, soybean flour, millet and sorghum flour and an innovation is being created without the use of widely used starches in existing gluten-free flours. Since the starch in gluten-free products was not removed in the prior art, the use of these products for diabetic patients was not possible. In other words, starch was gluten- free, which was advantageous for celiac disease but was a disadvantage for diabetics. We have solved this problem using diabetic flour instead of starch. We have removed this negativity by using diabetic flour instead of starch and combining the two products which contrast with the known technique.

The formulation for leaf flour is determined as at least one of the following types of flours; quinoa, lupine, teff, taro flour, amarant, chickpea flour, corn flour, lentil flour, sweet potato flour, soybean flour, millet and sorghum flour in the amount of %97, %1 amount of modified corn flour (corn suprex) and/or %1 -2 amount of gum, and %1 amount of E472e Mono- and di-glycerides diacetyltartaric acid esters.

In the product by using, blood sugar level correcting components such as flax seed, almond flour, cinnamon, sweet potato, blueberry, grape kernel and natural fruit extracts instead of artificial aromas and natural dyes instead of synthetic dyes a more natural product has been produced.

Fruits with low glycemic index are selected for the real fruit extract (such as bananas, strawberries, nuts, peanuts, walnuts, almonds, pistachios, pine nuts). In addition, at least one of following spices is added if desired to the product; cinnamon, clove, ginger, blueberry, flaxseed, turmeric, cardamom, mahalep spices.

Preparation Method:

The method to be described in this section is for sampling and does not aim at any restriction in use.

50 kg flour mixture and 70 kg water are added to the fast spinning dough mixer. As the baking powder, sodium bicarbonate in the range of 50 - 100 gr, ammonium bicarbonate in the range of 100 - 200 gr, sodium aluminate phosphate (SALP) in 10 gr, and 2 g of sodium meta bisulphite are used. Meta bisulphite is not used as a baking powder here, but to reduce its solubility if the dough is concise. Aluminum sulphate is used as a baking powder. Apart from that, 100 gr of lecithin and 100 g of sunflower oil are mixed for 5 minutes and then rested for 1 minute.

After pouring 120 grams of dough into the wafer plates, it is cooked for 2 minutes. In this process, 70 gr of moisture is extracted from the dough and a wafer leaf is obtained with a weight of 50 g and a moisture of %2. Cream is spread between these waffle leaves, which are aligned as 5 sheets of leaves and 4 lines of cream, through a cream spreading machine. With the addition of cream, the proportion of the material in the wafers has been resulted to 75% cream and 25% wafers. After that procedure, the wafers are cooled for 10 minutes in a 7-degree cooler (horizontal or vertical cooler). Then they are sliced with a cutting machine. Slicing in the cutting machine is done with 0,5 mm - 0,6 mm and 1 mm thick wires or 0,5 mm - 1 mm thick knives. The values of the obtained product are given in the following tables.

Length of a Slice (mm) Width of a Slice (mm) Height of a Slice (mm) Weight of a Slice (gr)

135 ± 1 33 ± 1 17 ± 2 40