Title:
GOLD DISPLACEMENT PLATING SOLUTION, AND METHOD FOR FORMATION OF JOINT PART
Document Type and Number:
WIPO Patent Application WO/2012/026159
Kind Code:
A1
Abstract:
The present invention provides a gold displacement plating solution and a plating treatment technique, both of which can achieve uniform film thicknesses in the formation of a joint part that comprises a nickel layer, a palladium layer and a gold layer laminated in this order. The present invention provides a gold displacement plating solution which is used for forming, on a conductive layer comprising an electrically conductive metal, a joint part that comprises a nickel layer, a palladium layer and a gold layer laminated in this order, and which is characterized in that the gold displacement plating solution contains a gold cyanide salt, a complexing agent and a copper compound, the ratio of the complexing agent to the copper compound, i.e., the complexing agent/copper ions, in the gold displacement plating solution falls within the range from 1.0 to 500 by mole, and a compound formed from the complexing agent and the copper compound has a stability constant of 8.5 or more at pH 4-6.
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Inventors:
KIKUCHI RIE (JP)
Application Number:
PCT/JP2011/059351
Publication Date:
March 01, 2012
Filing Date:
April 15, 2011
Export Citation:
Assignee:
ELECTROPLATING ENG (JP)
KIKUCHI RIE (JP)
KIKUCHI RIE (JP)
International Classes:
C23C18/52; C23C18/42; H05K3/24; H05K3/34
Domestic Patent References:
| WO2002016668A1 | 2002-02-28 |
Foreign References:
| JP2000192248A | 2000-07-11 |
Attorney, Agent or Firm:
TANAKA AND OKAZAKI (JP)
Patent business corporation Tanaka and Okazaki and associates (JP)
Patent business corporation Tanaka and Okazaki and associates (JP)
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