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Patent Searching and Data


Title:
GOLD FINGER CONNECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/059642
Kind Code:
A1
Abstract:
A gold finger connection device comprising an upper clamping plate (1) and a lower clamping plate (2), as well as a rubber pad (11) provided on the inner surface of the upper clamping plate (1); the rubber pad (11) is provided with a plurality of conductive strips capable of respectively corresponding to connection electrodes of gold fingers (31); the inner surface of the lower clamping plate (2) is provided with a protective layer (21) capable of guarding against the abrasion of the connection electrodes; the inner surface of the rubber pad (11) is in the form of a convex arc; a stop (22) capable of restricting the movement of the gold fingers is provided on each of two sides of the lower clamping plate (2); during use, the gold fingers (31) of an LCD (3) requiring testing are positioned on the lower clamping plate (2), the upper clamping plate (1) is positioned above the gold fingers (31) of the LCD (3), and the conductive strips are aligned one-to-one with the connection electrodes of the gold fingers (31); the upper clamping plate (1) applies pressure to the gold fingers (31), causing the conductive strips to be closely connected to and in full contact with the gold fingers (31) of the LCD, allowing test equipment test signals to be successfully transferred via the conductive strips into the LCD (3), thus beginning testing. The present invention has achieved a result wherein gold finger connection electrodes are guarded against abrasion.

Inventors:
ZHAO LIN (CN)
Application Number:
PCT/CN2012/083134
Publication Date:
April 24, 2014
Filing Date:
October 18, 2012
Export Citation:
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Assignee:
ZHAO LIN (CN)
International Classes:
H01R12/72; H01R13/02
Foreign References:
CN202817246U2013-03-20
CN102385041A2012-03-21
CN101154771A2008-04-02
CN201035042Y2008-03-12
CN102608476A2012-07-25
CN102193007A2011-09-21
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