Title:
GOLD PLATING FILM
Document Type and Number:
WIPO Patent Application WO/2007/077775
Kind Code:
A1
Abstract:
Disclosed is a gold plating film having excellent hardness and electrical conductivity. Specifically disclosed is a gold plating film which is composed of a single metal element. This gold plating film is composed of crystallites having an average particle diameter of not less than 17 nm but not more than 25 nm, while having a Vickers hardness of not less than 160 Hv.
Inventors:
FUJISHIGE MASATSUGU (JP)
ARAI SUSUMU (JP)
WANG FENG (JP)
ARAI SUSUMU (JP)
WANG FENG (JP)
Application Number:
PCT/JP2006/325725
Publication Date:
July 12, 2007
Filing Date:
December 25, 2006
Export Citation:
Assignee:
NAT UNIVERSITY CORP SHINSHU UN (JP)
MIKUNI KOGYO KK (JP)
FUJISHIGE MASATSUGU (JP)
ARAI SUSUMU (JP)
WANG FENG (JP)
MIKUNI KOGYO KK (JP)
FUJISHIGE MASATSUGU (JP)
ARAI SUSUMU (JP)
WANG FENG (JP)
International Classes:
C25D5/18; C25D3/48; C25D5/12
Foreign References:
| JPS5423036A | 1979-02-21 | |||
| JPH04345997A | 1992-12-01 | |||
| JP2002526157A | 2002-08-20 | |||
| JP2006131926A | 2006-05-25 | |||
| JP2006249484A | 2006-09-21 |
Attorney, Agent or Firm:
IAT WORLD PATENT LAW FIRM (Shinjuku Square Tower 22-1, Nishi-Shinjuku 6-chome, Shiinjuku-k, Tokyo 27, JP)
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