Title:
GRANULAR EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/128236
Kind Code:
A1
Abstract:
The present invention relates to a granular epoxy resin composition and a semiconductor device encapsulated using same.
Inventors:
KIM DAE JIN (KR)
KIM SEUNG TAEK (KR)
LEE EUN HAN (KR)
SHIM MYOUNG TAEK (KR)
KONG BYUNG SEON (KR)
KIM SEUNG TAEK (KR)
LEE EUN HAN (KR)
SHIM MYOUNG TAEK (KR)
KONG BYUNG SEON (KR)
Application Number:
PCT/KR2022/017357
Publication Date:
July 06, 2023
Filing Date:
November 07, 2022
Export Citation:
Assignee:
KCC CORP (KR)
International Classes:
C08L63/00; C08L33/02; C08L101/08; H01L23/29
Domestic Patent References:
| WO2016204183A1 | 2016-12-22 |
Foreign References:
| KR20130055514A | 2013-05-28 | |||
| JPH03167251A | 1991-07-19 | |||
| JP2006274184A | 2006-10-12 | |||
| KR20200085784A | 2020-07-15 |
Attorney, Agent or Firm:
SUNGAM SUH INTERNATIONAL PATENT & LAW FIRM (KR)
Download PDF:
Previous Patent: ELECTRONIC APPARATUS AND CONTROL METHOD THEREOF
Next Patent: INTEGRATED VEHICLE SUBSCRIPTION OPERATION AND MANAGEMENT SYSTEM
Next Patent: INTEGRATED VEHICLE SUBSCRIPTION OPERATION AND MANAGEMENT SYSTEM