Title:
GRANULAR POLISHING MATERIAL, POLISHING TOOL, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/012977
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a polishing material whereby it becomes possible to reduce the depths of scratches while improving a polishing rate and the processing ability cannot be deteriorated. Provided is a granular polishing material which comprises aggregates each comprising abrasive grains and a binder that binds the grains together, the granular polishing material being characterized in that each of the abrasive grains has such a structure that at least a part is coated with the binder and the aggregates have grain strength of 20 to 150 MPa.
Inventors:
ITO JUN (JP)
YASUI DAISUKE (JP)
YASUI DAISUKE (JP)
Application Number:
PCT/JP2019/025690
Publication Date:
January 16, 2020
Filing Date:
June 27, 2019
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24D3/00; B24D3/14; B24D11/00
Foreign References:
| JP2013503103A | 2013-01-31 | |||
| JP2004514017A | 2004-05-13 | |||
| JP2009511289A | 2009-03-19 | |||
| JP2018503520A | 2018-02-08 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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