GRANULAR RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR DEVICES

Title:

GRANULAR RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR DEVICES

Document Type and Number:

WIPO Patent Application WO/2023/068610

Kind Code:

A1

Abstract:

The present invention relates to a granular resin composition for the encapsulation of semiconductor devices and a semiconductor device encapsulated using same.

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Inventors:

KIM SEUNG TAEK (KR)
KIM DAE JIN (KR)
SHIM MYOUNG TAEK (KR)
KONG BYUNG SEON (KR)

Application Number:

PCT/KR2022/015108

Publication Date:

April 27, 2023

Filing Date:

October 07, 2022

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Assignee:

KCC CORP (KR)

International Classes:

C08L63/00; C08J3/12; H01L23/29

Foreign References:

KR20170003379A	2017-01-09
JP2017088828A	2017-05-25
JP2017057313A	2017-03-23
JP5736643B2	2015-06-17
JPH10275818A	1998-10-13

Attorney, Agent or Firm:

SUNGAM SUH INTERNATIONAL PATENT & LAW FIRM (KR)

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