Title:
GRANULATED RESIN ADDITIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/125682
Kind Code:
A1
Abstract:
Disclosed is a granulated resin additive composition which contains an aromatic metal phosphate salt and a phenolic antioxidant and provides a resin composition that has excellent mechanical strength and transparency when blended into a resin.
Specifically disclosed is a granulated resin additive composition which contains a phosphate salt compound represented by general formula (I) (wherein R1, R2, R3 and R4 each independently represents a hydrogen atom or an optionally branched alkyl group having 1-8 carbon atoms, X represents a direct bond or an alkylidene group having 1-4 carbon atoms, M represents an alkali metal, an alkaline earth metal or aluminum, n represents an integer of 1-3, and m represents 0 or 1), a phenolic antioxidant, and a fatty acid calcium salt. The granulated resin additive composition is characterized in that the content of the fatty acid calcium salt is 1-6 parts by mass relative to 100 parts by mass of the granulated resin additive composition.
Inventors:
SHIMIZU TOMONORI (JP)
TANJI NAOKO (JP)
SAKAI ATSUSHI (JP)
TANJI NAOKO (JP)
SAKAI ATSUSHI (JP)
Application Number:
PCT/JP2011/057911
Publication Date:
October 13, 2011
Filing Date:
March 29, 2011
Export Citation:
Assignee:
ADEKA CORP (JP)
SHIMIZU TOMONORI (JP)
TANJI NAOKO (JP)
SAKAI ATSUSHI (JP)
SHIMIZU TOMONORI (JP)
TANJI NAOKO (JP)
SAKAI ATSUSHI (JP)
International Classes:
C08K5/527; C08K5/098; C08K5/13; C08L23/00
Domestic Patent References:
| WO2007039997A1 | 2007-04-12 |
Foreign References:
| JP2005162867A | 2005-06-23 | |||
| JP2003313444A | 2003-11-06 | |||
| JP2001123021A | 2001-05-08 | |||
| JP2008231143A | 2008-10-02 | |||
| JP2004083852A | 2004-03-18 | |||
| JP2002332383A | 2002-11-22 | |||
| JP2009062417A | 2009-03-26 | |||
| JPH05179056A | 1993-07-20 | |||
| JPH0691152A | 1994-04-05 | |||
| JPH09157437A | 1997-06-17 | |||
| JP2009062417A | 2009-03-26 | |||
| JPS462280A | ||||
| JPS5030039A | 1975-03-26 | |||
| JPS5129129A | 1976-03-12 | |||
| JPH0336839A | 1991-02-18 | |||
| JPS61174270A | 1986-08-05 | |||
| JP2001164042A | 2001-06-19 | |||
| JP2002053722A | 2002-02-19 |
Other References:
See also references of EP 2554586A4
Attorney, Agent or Firm:
HONDA ICHIRO (JP)
Ichiro Honda (JP)
Ichiro Honda (JP)
Download PDF:
Claims:
Previous Patent: BOOSTER COMPRESSOR INTEGRAL WITH MOTOR
Next Patent: ADHESIVE SHEET FOR SEMICONDUCTOR WAFER PROCESSING
Next Patent: ADHESIVE SHEET FOR SEMICONDUCTOR WAFER PROCESSING