Title:
GRINDING APPARATUS AND GRINDING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/198635
Kind Code:
A1
Abstract:
A double head grinding apparatus (1) is provided with: a spindle drive unit (30) that rotates a spindle (31) to which a grinding wheel (10) can be attached; a moving unit (90) that moves the spindle drive unit (30) in the direction to be in contact with and/or to be away from a wafer (W); and a tilt measuring unit (60) that measures a tilt change of the spindle (31) due to the moving of the spindle drive unit (30).
Inventors:
NISHIMURA YOSHINOBU (JP)
Application Number:
PCT/JP2015/055719
Publication Date:
December 30, 2015
Filing Date:
February 26, 2015
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
B24B49/02; B24B7/17; B24B41/047; B24B47/12; B24B49/10; G01B21/22; H01L21/304
Domestic Patent References:
| WO2004033148A1 | 2004-04-22 |
Foreign References:
| JPH05131349A | 1993-05-28 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
Bottom intellectual property office of patent business corporation Tatsuyuki (JP)
Bottom intellectual property office of patent business corporation Tatsuyuki (JP)
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