Title:
GRINDING APPARATUS AND GRINDING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/138355
Kind Code:
A1
Abstract:
According to an embodiment of the present invention, a grinding apparatus is provided with a stage, and a plurality of grinding heads. The stage holds a substrate. The grinding heads are selectively pressed to a substrate surface to be ground. Furthermore, each of the grinding heads has a grinding surface having an area that is smaller than that of the surface to be ground, and in the cases where the stage is viewed from the direction perpendicular to the stage, the grinding heads are disposed at positions overlapping the surface to be ground.
Inventors:
FUKUOKA TETSUO (JP)
AKIMOTO MASAMI (JP)
KIYOTA KENJI (JP)
SAKAMOTO TAKAHIRO (JP)
AKIMOTO MASAMI (JP)
KIYOTA KENJI (JP)
SAKAMOTO TAKAHIRO (JP)
Application Number:
PCT/JP2017/002533
Publication Date:
August 17, 2017
Filing Date:
January 25, 2017
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B24B7/04; B24B41/06; H01L21/304
Foreign References:
| JPS55103140U | 1980-07-18 | |||
| JP2004154893A | 2004-06-03 | |||
| JPH0572359U | 1993-10-05 | |||
| JP2002301644A | 2002-10-15 | |||
| US20050176350A1 | 2005-08-11 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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