Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
GRINDING APPARATUS AND GRINDING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/003677
Kind Code:
A1
Abstract:
A grinding apparatus (100) of the present invention has: a susceptor (101) for a film-forming substrate arranged inside a film formation chamber (11); a grinding member (102) configured by a flat plate-shaped base (102A) and a protruding part (102B) formed on the surface thereof; a conveyance means (103) for conveying the grinding member (102) to be mounted on the susceptor (101); and a rotation means (104) for rotating the susceptor (101) around a central axis (101c). So that one main surface of the base (102A) faces opposite the susceptor (101), in a state with the grinding member (102) mounted on the susceptor (101), when the susceptor (101) and the grinding member (102) are seen in plan view, the outermost peripheral part of the grinding member (102) is at the outside of the outermost peripheral part of the susceptor (101).

Inventors:
FUKADA Keisuke (1505 Shimokagemori, Chichibu-sh, Saitama 93, 〒3691893, JP)
ISHIBASHI Naoto (1505 Shimokagemori, Chichibu-sh, Saitama 93, 〒3691893, JP)
Application Number:
JP2018/018732
Publication Date:
January 03, 2019
Filing Date:
May 15, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHOWA DENKO K.K. (13-9, Shibadaimon 1-chome Minato-k, Tokyo 18, 〒1058518, JP)
International Classes:
H01L21/205; B24B7/18; B24B27/033; C23C16/44
Foreign References:
US20130344244A12013-12-26
JPH05129205A1993-05-25
JPH02145767A1990-06-05
Attorney, Agent or Firm:
OIKAWA Shu et al. (1-9-2, Marunouchi Chiyoda-k, Tokyo 20, 〒1006620, JP)
Download PDF: