Title:
GRINDING APPARATUS, SEMICONDUCTOR DEVICE PRODUCING METHOD USING THE SAME, AND SEMICONDUCTOR DEVICE PRODUCED BY THE METHOD
Document Type and Number:
WIPO Patent Application WO/2005/016595
Kind Code:
A1
Abstract:
In a grinding apparatus (1), a grinding member (40) is vertically movably installed on a head housing (31) by using a drive plate (10). The grinding apparatus (1) has a strain gauge (92) capable of detecting a deformation amount of the drive plate (10), a lock mechanism (91) capable of restricting a vertical movement of a grinding head (30), and a control section (90) for controlling operation of the lock mechanism (91). Before starting grinding, when the grinding head (30) moves downward to bring the grinding member (40) into contact with a wafer (20) and the amount of deformation, detected by the strain gauge (92), of the drive plate (10) is near zero, the control section (90) activates the lock mechanism (91) to restrict a vertical movement of the grinding head (30).
Inventors:
HOSHINO SUSUMU (JP)
YAMAMOTO EIICHI (JP)
ASADA NAOKI (JP)
YAMAMOTO EIICHI (JP)
ASADA NAOKI (JP)
Application Number:
PCT/JP2004/011566
Publication Date:
February 24, 2005
Filing Date:
August 05, 2004
Export Citation:
Assignee:
NIKON CORP (JP)
HOSHINO SUSUMU (JP)
YAMAMOTO EIICHI (JP)
ASADA NAOKI (JP)
HOSHINO SUSUMU (JP)
YAMAMOTO EIICHI (JP)
ASADA NAOKI (JP)
International Classes:
B24B37/00; B24B49/16; H01L21/304; (IPC1-7): B24B37/00; H01L21/304
Foreign References:
| JPH11156711A | 1999-06-15 | |||
| JPH11347918A | 1999-12-21 | |||
| JP2001138229A | 2001-05-22 | |||
| JP2001054860A | 2001-02-27 | |||
| JPH11860A | 1999-01-06 |
Attorney, Agent or Firm:
Ohnishi, Shogo (HIGASHI-IKEBUKURO SS BUILDING 1F 3-20-3, Higashi-Ikebukur, Toshima-ku Tokyo 13, JP)
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