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Patent Searching and Data


Title:
GRINDING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/126107
Kind Code:
A1
Abstract:
Provided is a grinding apparatus capable of performing high precision double-headed flat grinding. A grinding apparatus for double-headed grinding of a cylinder and piston for configuring a rotary compressor is provided with: a pair of rotating grindstones disposed facing each other on the same rotation shaft center with a space therebetween; a carrier plate inserted between the pair of rotating grindstones; a rotation mechanism for rotating the carrier plate; and a control unit for controlling the operation of the rotating grindstones and the rotation mechanism. The carrier plate is provided with pockets for holding a cylinder or a piston. The control unit performs control so as to rotate the carrier plate using the rotation mechanism and to alternately perform double-headed grinding of the cylinder and piston held in said pockets with the rotating grindstones.

Inventors:
TANAKA MASAYUKI (JP)
HONOKI TSUGUO (JP)
FUKUI CHIHIRO (JP)
Application Number:
PCT/JP2016/051866
Publication Date:
July 27, 2017
Filing Date:
January 22, 2016
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B24B7/17; B24B19/10; F04C29/00
Foreign References:
JPS60183146U1985-12-05
JP2002307269A2002-10-23
JPH10277896A1998-10-20
JP2004268232A2004-09-30
JP2000271842A2000-10-03
Attorney, Agent or Firm:
KISA PATENT & TRADEMARK FIRM (JP)
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