Title:
GRINDING METHOD AND GRINDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2004/048033
Kind Code:
A1
Abstract:
A grinding method for grinding the peripheral surface of a rotating work (10) by a grinding wheel (22) rotated by a grinding wheel spindle (21), comprising the steps of mounting a rotating brush (40) rotated together with the rotating grinding wheel (22) on one side thereof, grinding the work (10) by the rotating grinding wheel (22), and moving the rotating grinding wheel (22) and the work (10) relative to each other in axial direction to brush the ground surface of the work (10) by the rotating brush (40) so as to polish the ground surface of the work (10), whereby the need of a work transfer and exclusive deburring and polishing devices can be eliminated to contribute to a reduction in processing cost.
Inventors:
MURAI FUKUO (JP)
Application Number:
PCT/JP2003/011673
Publication Date:
June 10, 2004
Filing Date:
September 12, 2003
Export Citation:
Assignee:
MUSASHI SEIMITSU INDUSTRY CO L (JP)
MURAI FUKUO (JP)
MURAI FUKUO (JP)
International Classes:
B24B5/04; B24B9/00; B24B19/08; B24B19/12; B24B29/00; B24D13/10; (IPC1-7): B24B5/04; B24B9/00
Foreign References:
| JPH0724712A | 1995-01-27 | |||
| JPH07276197A | 1995-10-24 | |||
| JPH09300193A | 1997-11-25 |
Other References:
See also references of EP 1591197A4
Attorney, Agent or Firm:
Ochiai, Takeshi (6-3 Taito 2-chom, Taito-ku Tokyo, JP)
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