Title:
GRINDING METHOD AND GRINDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/131846
Kind Code:
A1
Abstract:
The present invention performs grinding wherein adhesion of machining dust to the abrasive grain surface of a diamond grindstone is prevented as much as possible. A grinding device (1) is for grinding a workpiece (W) made of a superalloy on the grinding surface (2ba) of a diamond grindstone (2b) of a grinding wheel (2) while rotating the grinding wheel (2). This grinding device is provided with an abrasion liquid spraying means (3) for spraying, on the grinding surface (2ba), a high-pressure abrasion liquid through a nozzle (3a) from a direction orthogonal to the grinding surface (2ba) so as to wash off grinding powder. The abrasion liquid spraying means (3) is disposed at an abrasion liquid spraying position (P1) different from a workpiece grinding position (P2) for grinding the workpiece (W). A nozzle (3a) of the abrasion liquid spraying means (3) is configured to oscillate.
Inventors:
MORIGO CHIKARA (JP)
Application Number:
PCT/JP2018/048065
Publication Date:
July 04, 2019
Filing Date:
December 27, 2018
Export Citation:
Assignee:
TOKUPI MFG CO LTD (JP)
International Classes:
B24B53/007; B24B55/02; B24D3/00
Foreign References:
| JPS6158060U | 1986-04-18 | |||
| JPS4995588U | 1974-08-17 | |||
| JP2001096461A | 2001-04-10 | |||
| JPS5121294A | 1976-02-20 |
Attorney, Agent or Firm:
TORISU Minoru et al. (JP)
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