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Patent Searching and Data


Title:
GRINDING WHEEL AND METHOD FOR MANUFACTURING GRINDING WHEEL
Document Type and Number:
WIPO Patent Application WO/2016/068283
Kind Code:
A1
Abstract:
This grinding wheel is provided with a disc-like member and a grindstone layer arranged on the outer peripheral surface of the disc-like member. The grindstone layer is provided with multiple grindstone chips divided in the circumferential direction. Each of the circumferentially divided grindstone chips is formed by an axial arrangement of a first grindstone chip and second grindstone chip, said first and second grindstone chips having different properties from each other. Boundaries between the first grindstone chip and the second grindstone chip in at least three circumferentially divided grindstone chips continuously arranged in the circumferential direction are arrayed so that there is a shift toward a predetermined direction in the axial direction in the order in which the circumferentially divided grindstone chips are arranged.

Inventors:
WATANABE AKIRA (JP)
Application Number:
PCT/JP2015/080711
Publication Date:
May 06, 2016
Filing Date:
October 30, 2015
Export Citation:
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Assignee:
JTEKT CORP (JP)
International Classes:
B24D5/14
Foreign References:
JPH11188640A1999-07-13
JP2002537136A2002-11-05
JPH08252772A1996-10-01
Attorney, Agent or Firm:
UENO, HIDEKI (JP)
Ueno Hideki (JP)
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