Title:
GRINDSTONE AND GRINDING/POLISHING DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2014/061423
Kind Code:
A1
Abstract:
[Problem] To provide a grindstone and a grinding/polishing device using same with which, in addition to it being possible to perform the three processes of rough processing, lapping, and polishing with the same device: double-sided processing is also possible; processing rate does not decrease even when used continuously; and dressing can be omitted. [Solution] A grindstone for grinding/polishing a workpiece, the grindstone being characterized in comprising multiple grindstone bars, which are obtained from a binder and abrasive grains for grinding/polishing the workpiece and disposed in parallel with an axis (L) in the depth direction of the grinding/polishing surface, and a grindstone matrix integrally formed with the grindstone bars, and a grinding/polishing device using said grindstone.
Inventors:
TAKADA ATSUSHI (JP)
TAKATSU MASAKAZU (JP)
OHASHI KYOSUKE (JP)
HORIE KAZUYA (JP)
ISHIZAKI KOZO (JP)
TAKATSU MASAKAZU (JP)
OHASHI KYOSUKE (JP)
HORIE KAZUYA (JP)
ISHIZAKI KOZO (JP)
Application Number:
PCT/JP2013/076164
Publication Date:
April 24, 2014
Filing Date:
September 27, 2013
Export Citation:
Assignee:
NANO TEM CO LTD (JP)
International Classes:
B24D7/06; B24B7/22; B24B37/12; B24D7/14
Foreign References:
JPH0957614A | 1997-03-04 | |||
JP2001088017A | 2001-04-03 | |||
JPH01193174A | 1989-08-03 | |||
JP2004528184A | 2004-09-16 | |||
JP2008006529A | 2008-01-17 |
Attorney, Agent or Firm:
MATSUMOTO, Yoshikazu (JP)
Etsuichi Matsumoto (JP)
Etsuichi Matsumoto (JP)
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