Title:
GRINDSTONE
Document Type and Number:
WIPO Patent Application WO/2008/044408
Kind Code:
A1
Abstract:
[PROBLEMS] To provide a grindstone that even in the event of chamfer machining
of an edge portion of plate glass, ensures prevention of any defect or breakage
thereof without productivity decrease, and provide a method of machining an
end face of plate glass. [MEANS FOR SOLVING PROBLEMS] The grindstone (10) comprises
aluminum disk-shaped base metal (10a) provided at its center with hole portion
(10a', with 120 mm outside diameter, 80 mm inside diameter and 40 mm thickness);
ringlike shock absorption layer (10b, with 10 mm thickness) of, for example,
phenolic resin, bonded to the outer circumferential surface of the disk-shaped
base metal (10a); and ringlike abrasive grain layer (10c, with 5 mm thickness)
bonded to the outer circumferential surface of the shock absorption layer (10b).
Inventors:
NISHIMURA NAOKI (JP)
Application Number:
PCT/JP2007/067406
Publication Date:
April 17, 2008
Filing Date:
September 06, 2007
Export Citation:
Assignee:
NIPPON ELECTRIC GLASS CO (JP)
NISHIMURA NAOKI (JP)
NISHIMURA NAOKI (JP)
International Classes:
B24D5/00; B24B9/10; B24D3/00; B24D3/28
Foreign References:
| JPS5364891A | 1978-06-09 | |||
| JPH0699357A | 1994-04-12 | |||
| JP2005052944A | 2005-03-03 |
Attorney, Agent or Firm:
TANAKA, Hideyoshi et al. (15-26 Edobori,1-chome, Nishi-ku,Osaka-shi, Osaka 02, JP)
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