Title:
GRIPPING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2018/212194
Kind Code:
A1
Abstract:
The present invention is capable of gripping a target object while minimizing the impact on how the target object is positioned. The present invention pertains to a gripping system which grips a target object using a hand mechanism having two or more finger parts, and executes repositioning/gripping which involves repositioning and then gripping the target object. In order to perform the repositioning/gripping, a first operation determination unit determines a first operation contact surface to be contacted by a first finger part in order to perform a first operation for repositioning the object to be gripped while pressing said object against another object, and a second operation determination unit determines a second operation contact surface, which is a surface of the object to be gripped that is different from the first operation contact surface and is used for a second operation for gripping the repositioned object to be gripped.
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Inventors:
MATSUO YOSHIKAZU (JP)
KAWABATA SHINJI (JP)
KAWABATA SHINJI (JP)
Application Number:
PCT/JP2018/018797
Publication Date:
November 22, 2018
Filing Date:
May 15, 2018
Export Citation:
Assignee:
THK CO LTD (JP)
International Classes:
B25J15/08; B25J13/00
Foreign References:
| JP2013126706A | 2013-06-27 | |||
| JPH11300670A | 1999-11-02 | |||
| JP2002200588A | 2002-07-16 | |||
| JP2001179669A | 2001-07-03 | |||
| JP2008149444A | 2008-07-03 | |||
| JPH06143170A | 1994-05-24 | |||
| JPH09323281A | 1997-12-16 | |||
| JP2011115930A | 2011-06-16 | |||
| JP2014138964A | 2014-07-31 | |||
| EP2899149A1 | 2015-07-29 |
Attorney, Agent or Firm:
HIRAKAWA, Akira et al. (JP)
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