Title:
GROOVE PROCESSING DEVICE AND GROOVE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/230821
Kind Code:
A1
Abstract:
A groove processing device (100) for forming a groove on a surface of an object by a laser beam comprises: a light source device (11) that outputs the laser beam; a polygon mirror (10) that reflects the laser beam outputted from the light source device (11); and an optical system that is provided in the optical path of the laser beam reflected from the polygon mirror (10), the optical system having a condensing portion (13A) that allows the laser beam reflected from one surface of the polygon mirror (10) to pass therethrough and focuses the laser beam on the surface of the object, and a non-condensing portion (13B) that is provided outside the condensing portion (13A), allows the laser beam reflected from the corner portions that straddle the two adjacent faces of the polygon mirror (10) to pass through, and does not condense light on the surface of the object.
Inventors:
HAMAMURA HIDEYUKI (JP)
Application Number:
PCT/JP2020/019132
Publication Date:
November 19, 2020
Filing Date:
May 13, 2020
Export Citation:
Assignee:
NIPPON STEEL CORP (JP)
International Classes:
B23K26/364; B23K26/064; B23K26/082; G02B26/12
Foreign References:
| JPH07178581A | 1995-07-18 | |||
| JP2014161899A | 2014-09-08 | |||
| JP2002028798A | 2002-01-29 | |||
| JP2019091044A | 2019-06-13 | |||
| JP2002292484A | 2002-10-08 |
Other References:
See also references of EP 3970904A4
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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