Title:
GROOVED POLISHING PADS AND METHODS OF USE
Document Type and Number:
WIPO Patent Application WO2002002279
Kind Code:
A3
Abstract:
Grooves are formed in a CMP (12) pad by positioning the pad on a supporting surface with a working surface (22) of the pad in spaced relation opposite to a router bit (24) and at least one projecting stop member (33) adjacent to the router bit, an outer end portion of the bit projecting beyond the stop. When the bit is rotated, relative axial movement between the bit and the pad causes the outer end portion of the bit to cut an initial recess in the pad. Relative lateral movement between the rotating bit and the pad then forms a groove which extends laterally away from the recess and has a depth substantially the same as that of the recess. Different lateral movements between the bit and the pad are used to form a variety of groove patterns, the depths of which are precisely controlled by the stop member(s). The grooves may be formed in the polishing surface and/or the rear opposite surface of the pad and passages may be provided for interconnecting the rear grooves with the polishing surface or the front grooves. Grooves in the polishing surface may be provided with outlets through which a polishing slurry may flow while the polishing surface is in contact with a workpiece surface.
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Inventors:
CHEN SHYNG-TSONG (US)
DAVIS KENNETH M (US)
RODBELL KENNETH P (US)
DAVIS KENNETH M (US)
RODBELL KENNETH P (US)
Application Number:
PCT/US2001/020904
Publication Date:
May 30, 2002
Filing Date:
June 29, 2001
Export Citation:
Assignee:
IBM (US)
CHEN SHYNG TSONG (US)
DAVIS KENNETH M (US)
RODBELL KENNETH P (US)
CHEN SHYNG TSONG (US)
DAVIS KENNETH M (US)
RODBELL KENNETH P (US)
International Classes:
B24B37/26; B24D13/12; B24D13/14; B24D18/00; H01L21/304; (IPC1-7): B24D13/12; B24D13/14; B24B37/04; B24D18/00
Foreign References:
| EP0878270A2 | 1998-11-18 | |||
| US6001001A | 1999-12-14 | |||
| US5913713A | 1999-06-22 | |||
| US6056851A | 2000-05-02 |
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