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Title:
GROUND MEMBER, SHIELDED PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING SHIELDED PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2018/147423
Kind Code:
A1
Abstract:
An objective of the present invention is to provide a ground member which can be positioned as desired, and which, when using repeated heating and cooling to mount components onto a shielded printed circuit board using the ground member, is less susceptible to deviations occurring between conductive protrusions of the ground member and a shield layer of a shield film. This ground member comprises an external connection member which has a first main surface and a second main surface opposite to the first main surface, and which is conductive. The first main surface of the ground member has conductive protrusions, and the ground member is characterized in that a layer of a metal with a low melting point is formed on the surface of the conductive protrusions.

Inventors:
HARUNA YUUSUKE (JP)
KATSUKI TAKAHIKO (JP)
HASEGAWA TSUYOSHI (JP)
TAJIMA HIROSHI (JP)
Application Number:
PCT/JP2018/004654
Publication Date:
August 16, 2018
Filing Date:
February 09, 2018
Export Citation:
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Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K1/02; H05K9/00
Foreign References:
JP4201548B22008-12-24
JPH03257769A1991-11-18
JP2002111154A2002-04-12
JP2016029748A2016-03-03
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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