Title:
GROUNDING STRUCTURE FOR HIGH FREQUENCY CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2020/070919
Kind Code:
A1
Abstract:
This grounding structure for a high-frequency circuit board has: a dielectric substrate; a rear surface grounding electrode; an upper grounding electrode; and a microstrip line upper electrode. The dielectric substrate has a first surface and a second surface, the dielectric substrate being provided with a first through hole. A first opening of the first through hole in the first surface is smaller than a second opening of the first through hole in the second surface. A first ground conductor layer is provided inside the first through hole. A rear surface electrode is provided on the second surface, and is connected to the first ground conductor layer. The upper grounding electrode is provided on the first surface, and is connected to the first ground conductor layer. The microstrip line upper electrode is provided on the first surface.
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Inventors:
ASAHI YASUAKI (JP)
KOJIMA HARUO (JP)
KOJIMA HARUO (JP)
Application Number:
PCT/JP2019/020861
Publication Date:
April 09, 2020
Filing Date:
May 27, 2019
Export Citation:
Assignee:
TOSHIBA KK (JP)
TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORP (JP)
TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORP (JP)
International Classes:
H01P5/08; H01L23/12; H01P3/00; H01P5/02; H05K1/02; H05K3/34
Foreign References:
| JP2011172173A | 2011-09-01 | |||
| JPH04297085A | 1992-10-21 | |||
| JPH11145335A | 1999-05-28 | |||
| JP2002313982A | 2002-10-25 | |||
| JPS59112701A | 1984-06-29 |
Other References:
See also references of EP 3863113A4
Attorney, Agent or Firm:
HYUGAJI, Masahiko et al. (JP)
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