HALO-HYDROCARBON POLYMER COATING

WIPO Patent Application WO/2010/020753

A3

In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.

HUMPHRIES MARK ROBSON (GB)
FERDINANDI FRANK (GB)
SMITH RODNEY EDWARD (GB)

PCT/GB2009/001966

June 24, 2010

August 11, 2009

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SEMBLANT LTD (GB)
HUMPHRIES MARK ROBSON (GB)
FERDINANDI FRANK (GB)
SMITH RODNEY EDWARD (GB)

H05K3/28; C12Q1/00; H01H13/70; H01L23/485; H05K3/34

WO2008102113A2

2008-08-28

US20080176096A1	2008-07-24
US3931454A	1976-01-06
DE102007062787A1	2008-07-17
US20060103030A1	2006-05-18
US20040026775A1	2004-02-12
US3745536A	1973-07-10
US4268568A	1981-05-19
US7112265B1	2006-09-26
GB1399252A	1975-07-02
US6183883B1	2001-02-06

ANONYMOUS: "Circuit board soldering through conformal coating", RESEARCH DISCLOSURE, MASON PUBLICATIONS, HAMPSHIRE, GB, vol. 293, no. 68, 1 September 1988 (1988-09-01), XP007112948, ISSN: 0374-4353

KEMP, Paul, Geoffrey (41 Lothbury, London EC2R 7HF, GB)

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