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Patent Searching and Data


Title:
HALOGEN-FREE EPOXY FORMULATIONS
Document Type and Number:
WIPO Patent Application WO/2016/029450
Kind Code:
A1
Abstract:
A curable composition comprising a) an epoxy resin; and b) a hardener component comprising i) an oligomeric compound comprising a phosphorus composition which is the reaction product of an etherified resole with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, and ii) naphthol novolac, is disclosed. The curable composition can be used to prepare electrical laminates and printed circuit boards.

Inventors:
YAN JINGJING (CN)
LIAO GUIHONG (CN)
CHEN HONGYU (CN)
WILSON MARK B (US)
TAI XIANGYANG (CN)
HE XIAORONG (CN)
ZHU LU (CN)
FENG YANLI (CN)
Application Number:
PCT/CN2014/085576
Publication Date:
March 03, 2016
Filing Date:
August 29, 2014
Export Citation:
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Assignee:
BLUE CUBE IP LLC (US)
YAN JINGJING (CN)
LIAO GUIHONG (CN)
CHEN HONGYU (CN)
WILSON MARK B (US)
TAI XIANGYANG (CN)
HE XIAORONG (CN)
ZHU LU (CN)
FENG YANLI (CN)
International Classes:
C08L63/00
Domestic Patent References:
WO2011094004A22011-08-04
WO2013095908A22013-06-27
WO2009045817A12009-04-09
Attorney, Agent or Firm:
WU, FENG & ZHANG CO. (Tower BBeijing Aerospace CPMIEC Building,No. 30 Haidian South Road, Haidian District, Beijing 0, CN)
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