Title:
HALOGEN-FREE RESIN COMPOSITION AS WELL AS PREPREG AND LAMINATED BOARD USED FOR PRINTED CIRCUIT THAT ARE MADE OF HALOGEN-FREE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/011705
Kind Code:
A1
Abstract:
The present invention relates to a halogen-free resin composition as well as a prepreg and a laminated board used for a printed circuit that are made of the halogen-free resin composition. Based on 100 parts by weight of organic cured products, the resin composition comprises: (A) 30 to 60 parts by weight of bisphenol epoxy resin, (B) 5 to 45 parts by weight of benzoxazine resin, (C) 10 to 30 parts by weight of an alkyl phenol phenolic curing agent, and (D) phosphorus-containing flame retardant. The structure of the bisphenol epoxy resin contains many alkyl branched chains and benzene rings, so that the bisphenol epoxy resin has high glass transition temperature, low absorption of water, good thermal resistance and excellent dielectric performance. The alkyl phenol phenolic is used as the curing agent, which makes full use of the advantages of the alkyl phenol phenolic that the alkyl phenol phenolic has many alkyl groups and thus has excellent dielectric performance and low absorption of water. The prepreg and the laminated board used for a printed circuit that are made of the halogen-free thermosetting resin composition have high glass transition temperature, low dielectric constant, low dielectric loss factor, low absorption of water, high thermal resistance and good flame retardancy, processing performance and chemical resistance.
Inventors:
YOU JIANG (CN)
Application Number:
PCT/CN2014/087281
Publication Date:
January 28, 2016
Filing Date:
September 24, 2014
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L63/02; C08K5/49; C08L61/06; C08L79/04
Domestic Patent References:
| WO2013134752A1 | 2013-09-12 |
Foreign References:
| CN103834168A | 2014-06-04 | |||
| CN103421273A | 2013-12-04 | |||
| CN101831139A | 2010-09-15 | |||
| US20130161080A1 | 2013-06-27 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
北京品源专利代理有限公司 (CN)
北京品源专利代理有限公司 (CN)
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