Title:
HALOGEN-FREE THERMOSETTING RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED CIRCUITS USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/148127
Kind Code:
A1
Abstract:
Disclosed are a halogen-free thermosetting resin composition and a prepreg and a laminate for printed circuits using same. The halogen-free thermosetting resin composition contains, based on 100 parts by weight of organic solids, (A) 16-42 parts by weight of a halogen-free epoxy resin, (B) 1.5-4.8 parts by weight of a compound having a dihydrobenzoxazine ring, (C) 10-28 parts by weight of a phosphorus-containing bisphenol curing agent, the weight average molecular weight of the phosphorus-containing bisphenol is 1000-6500, and (D) 30-70 parts by weight of silicon dioxide. The prepreg and laminate for printed circuits prepared from the halogen-free thermosetting resin composition have a high glass transition temperature, excellent dielectric properties, low water absorption, a high thermal resistance and a good processability, and can achieve halogen-free flame retardancy, which can reach UL94 V-0 grade.
Inventors:
YOU JIANG (CN)
HUANG TIANHUI (CN)
XU YONGJING (CN)
YANG ZHONGQIANG (CN)
HUANG TIANHUI (CN)
XU YONGJING (CN)
YANG ZHONGQIANG (CN)
Application Number:
PCT/CN2016/098449
Publication Date:
September 08, 2017
Filing Date:
September 08, 2016
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
B32B15/092; C08L63/00; B32B27/18; B32B33/00; C08G59/32; C08G59/62; C08K3/36; C08K5/357
Foreign References:
| CN105331053A | 2016-02-17 | |||
| CN1723243A | 2006-01-18 | |||
| CN101880294A | 2010-11-10 | |||
| CN1639174A | 2005-07-13 | |||
| CN104024338A | 2014-09-03 | |||
| CN104804377A | 2015-07-29 | |||
| JP2001302879A | 2001-10-31 | |||
| CN1723243A | 2006-01-18 | |||
| JP2001302879A | 2001-10-31 |
Other References:
See also references of EP 3241868A4
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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