Title:
HALOGEN-FREE THERMOSETTING RESIN COMPOSITION AND PREPREG, LAMINATE AND PRINTED CIRCUIT BOARD CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2018/120587
Kind Code:
A1
Abstract:
Provided in the present invention are a halogen-free thermosetting resin composition and a prepreg, a laminate and a printed circuit board containing the same. The halogen-free thermosetting resin composition contains the following three substances as essential components, using organic solid matter in 100 parts by weight: (A) a halogen-free epoxy resin: 35-65 parts by weight; (B) polyphosphonate: 10-35 parts by weight; (C) cyanate ester: 10-30 parts by weight. The halogen-free thermosetting resin composition, prepreg, laminate and printed circuit board containing the same which are provided in the present invention have a high glass transition temperature, excellent dielectric properties, high peel strength, high heat resistance, low water absorption and good processability, and may achieve a halogen-free flame retardant and reach the UL94 V-0 standard.
Inventors:
YOU JIANG (CN)
HUANG TIANHUI (CN)
LIN WEI (CN)
YANG ZHONGQIANG (CN)
HUANG TIANHUI (CN)
LIN WEI (CN)
YANG ZHONGQIANG (CN)
Application Number:
PCT/CN2017/084315
Publication Date:
July 05, 2018
Filing Date:
May 15, 2017
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L63/00; C08G59/26; C08L79/04; B32B5/02
Foreign References:
| CN103694642A | 2014-04-02 | |||
| CN105968321A | 2016-09-28 | |||
| CN102272226A | 2011-12-07 | |||
| CN105968320A | 2016-09-28 | |||
| CN104736592A | 2015-06-24 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
Download PDF: