Title:
HALOGEN FREE VERY LOW LOSS RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/237696
Kind Code:
A1
Abstract:
Provided herein are halogen-free, flame retardant curable resin compositions that provide both good electrical characteristics and good heat resistance characteristics sufficient to allow for their use in high-performance PCB systems. In particular, provided herein are new organophosphorus olefins that are useful as reactive-time flame retardants. Surprisingly, it has been discovered that these reactive-type compounds provide good dielectric performance and heat resistance when incorporated into PCB compositions. The presence of C=C double bonds in these organophosphorus olefins allows them to react with unsaturated resins (for example, C=C double capped polyphenyl ether, bismaleic imide, etc. ) to form a crosslinked network.
Inventors:
YE SIMON (CN)
WANG ETHAN (CN)
BAO EMERSON (CN)
WANG ETHAN (CN)
BAO EMERSON (CN)
Application Number:
PCT/CN2020/093361
Publication Date:
December 02, 2021
Filing Date:
May 29, 2020
Export Citation:
Assignee:
BLUE CUBE IP LLC (US)
YE SIMON (CN)
YE SIMON (CN)
International Classes:
C08L71/12; B32B15/08; C07F9/32; C08F222/40; C08F230/02; C08K3/36; C08K5/14; C08L85/02
Domestic Patent References:
| WO2019112920A1 | 2019-06-13 | |||
| WO2017067140A1 | 2017-04-27 |
Foreign References:
| US20110160366A1 | 2011-06-30 | |||
| CN102276837A | 2011-12-14 |
Attorney, Agent or Firm:
CHANG TSI & PARTNERS (CN)
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