Title:
HANDLER FOR SEMICONDUCTOR SINGULATION AND METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO2004040639
Kind Code:
A8
Abstract:
A water jet handler (200) has a loading location (205), a cutting location (210), and an unloading location (215); and two movable mounts (240 and a245). As a first movable mount (240) receives a molded substrate at the loading location (205), and transports it to the cutting location (210), a second movable mount (245) transports singulated semiconductor packages of a previously singulated molded substrate from the cutting location (210) to the unloading location (215). As the molded substrate on the first movable mount (240) is cut in the X direction (232) by a water jet, the singulated semiconductor packages are unloaded. The molded substrate is then transferred to the second movable mount (245) on which it is cut in the Y direction (272) to produce singulated semiconductor packages, as the first movable mount (240) returns to the loading location (205), where another molded substrate is loaded.
More Like This:
Inventors:
CHEW HWEE SENG JIMMY (SG)
LIU FULIN (SG)
LIM KOK YEOW (SG)
LIU FULIN (SG)
LIM KOK YEOW (SG)
Application Number:
PCT/SG2003/000204
Publication Date:
September 02, 2004
Filing Date:
August 29, 2003
Export Citation:
Assignee:
ADVANCED SYSTEMS AUTOMATION (SG)
CHEW HWEE SENG JIMMY (SG)
LIU FULIN (SG)
LIM KOK YEOW (SG)
CHEW HWEE SENG JIMMY (SG)
LIU FULIN (SG)
LIM KOK YEOW (SG)
International Classes:
B24C1/04; B24C3/08; B26D5/34; B26D7/06; B26F3/00; (IPC1-7): H01L21/50; H01L21/304
Download PDF: