Title:
HARD SUBSTRATE LAMINATE AND HARD SUBSTRATE LAMINATE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/192941
Kind Code:
A1
Abstract:
Provided is a hard substrate laminate useful for manufacturing sheet glass products with high production efficiency and low cost. A hard substrate laminate in which at least two hard substrates have been bonded to each other with an adhesive, the hard substrate laminate being intended for cutting of said laminate in the thickness direction to obtain a desired number of divided hard substrate laminates. Between the respective hard substrates, the adhesive is continuously present straddling all of the lines to be processed during cutting and between the respective hard substrates, there is a gap, in which there is no adhesive, in at least one of the areas surrounded by the processing lines.
Inventors:
EDA YUKIO (JP)
TAKESUE HIRONORI (JP)
IBAYASHI TOSHIYUKI (JP)
TANAKA KENJI (JP)
TAKESUE HIRONORI (JP)
IBAYASHI TOSHIYUKI (JP)
TANAKA KENJI (JP)
Application Number:
PCT/JP2014/064508
Publication Date:
December 04, 2014
Filing Date:
May 30, 2014
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK (JP)
International Classes:
B32B7/14; B24B9/10
Domestic Patent References:
| WO2007004620A1 | 2007-01-11 |
Foreign References:
| JP2010269389A | 2010-12-02 |
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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