Title:
HARDENABLE PRESSURE-SENSITIVE ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2007/066640
Kind Code:
A1
Abstract:
[PROBLEMS] To provide a hardenable pressure-sensitive adhesive film which is
excellent in cuttability and permits excellent shearing such as punching or
perforating without adhesive spew. [MEANS FOR SOLVING PROBLEMS] A hardenable pressure-sensitive
adhesive film (1), characterized by being produced by laminating an isotropic
support sheet (11) made of a resin which exhibits lengthwise and widthwise shear
strengths of 2 to 2000g [200mm/min·25mm width], preferably 5 to 1000g,
still preferably 10 to 500g in the thickness range of 2 to 60μm with a face
sheet (12) made of a resin-base pressure-sensitive adhesive. In the film (1),
the face sheet(s) (12) may be present on either or both sides of the support sheet
(11).
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Inventors:
HAMANO NAOKICHI (JP)
Application Number:
PCT/JP2006/324226
Publication Date:
June 14, 2007
Filing Date:
December 05, 2006
Export Citation:
Assignee:
KYODO GIKEN CHEMICAL CO LTD (JP)
HAMANO NAOKICHI (JP)
HAMANO NAOKICHI (JP)
International Classes:
C09J7/22; C09J7/25; C09J7/38; C09J201/00
Foreign References:
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Attorney, Agent or Firm:
OGURA, Masaaki (13-4 Shinbashi 5-chome, Minato-k, Tokyo 04, JP)
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