Title:
HARDENABLE PRESSURE SENSITIVE ADHESIVE SHEET FOR DICING/DIE-BONDING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2005/004216
Kind Code:
A1
Abstract:
[PROBLEMS] To provide a hardenable pressure sensitive adhesive sheet for dicing/die-bonding, which is free from the generation of voids between a hardenable pressure sensitive adhensive layer and a die pad portion even when a chip is placed on a die pad portion having great undulation and thus is excellent in embedment characteristics. [MEANS FOR SOLVING PROBLEMS] A hardenable pressure sensitive adhesive sheet for dicing/die-bonding, characterized in that it comprises a substrate and, provided thereon, a hardenable pressure sensitive adhesive layer which exhibits a ratio (M100/M50) of the modulus of elasticity at 100&ring C (M100) to the modulus of elasticity at 50&ring C (M50) of 0.5 or less.
Inventors:
SAIKI NAOYA (JP)
Application Number:
PCT/JP2004/009629
Publication Date:
January 13, 2005
Filing Date:
July 07, 2004
Export Citation:
Assignee:
LINTEC CORP (JP)
SAIKI NAOYA (JP)
SAIKI NAOYA (JP)
International Classes:
C09J7/22; C09J7/38; H01L21/68; (IPC1-7): H01L21/301; H01L21/52; C09J7/02
Domestic Patent References:
| WO2003017363A1 | 2003-02-27 |
Foreign References:
| JP2002226796A | 2002-08-14 | |||
| JP2004039928A | 2004-02-05 |
Other References:
See also references of EP 1650790A4
Attorney, Agent or Firm:
Suzuki, Shunichiro (Gotanda Yamazaki Bldg. 6F 13-6, Nishigotanda
7-chome, Shinagawa-k, Tokyo, JP)
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