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Patent Searching and Data


Title:
HEAD FOR HOLDING SUBSTRATE, AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/091500
Kind Code:
A1
Abstract:
Provided is a structure that reduces the risk imposed on a retainer member mounting mechanism when a substrate hits a retainer member. One embodiment provides a head for holding a polygonal substrate. The head includes a substrate support surface having a shape corresponding to the shape of the polygonal substrate, a retainer member arranged on the outside of each side of the substrate support surface, and a retainer guide supporting the retainer member, wherein the retainer member includes an engaging surface extending in a direction perpendicular to the substrate support surface, the engaging surface of the retainer member being engaged with the retainer guide.

Inventors:
KASHIWAGI MAKOTO (JP)
Application Number:
PCT/JP2021/027160
Publication Date:
May 05, 2022
Filing Date:
July 20, 2021
Export Citation:
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Assignee:
EBARA CORP (JP)
International Classes:
B24B37/32; B24B37/10; C03C19/00; H01L21/304
Foreign References:
JP2020019115A2020-02-06
JP2002198339A2002-07-12
JP2001179605A2001-07-03
JP2005011999A2005-01-13
JP2020182844A2020-11-12
JP2003179015A2003-06-27
US6019670A2000-02-01
JP2020019115A2020-02-06
JP2014176950A2014-09-25
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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