Title:
HEADPHONE COVER
Document Type and Number:
WIPO Patent Application WO/2020/262411
Kind Code:
A1
Abstract:
[Problem] To provide a headphone cover with which it is possible to stably maintain the state of a fabric covering a headphone without obstructing a sound from the headphone. [Solution] A headphone cover 1 comprises a fabric 14 having an opening 12 at a sound-conducting point on one side of an ear pad and being foldable 90 degrees from at least the one side to the other side, and a core part 16 that goes around the circumferential edge of the opening 12, the compressive yield stress of the core part 16 being 0.0587 MPa or greater.
Inventors:
YOKOTA SHUJI (JP)
Application Number:
PCT/JP2020/024681
Publication Date:
December 30, 2020
Filing Date:
June 23, 2020
Export Citation:
Assignee:
YOKOTA SHUJI (JP)
International Classes:
H04R1/10
Foreign References:
| JPH0644290U | 1994-06-10 | |||
| JP2015133609A | 2015-07-23 | |||
| JPH0634391U | 1994-05-06 |
Attorney, Agent or Firm:
KANEKO Hiroshi (JP)
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