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Patent Searching and Data


Title:
HEAT-BONDABLE PAPER SHEET
Document Type and Number:
WIPO Patent Application WO/1991/002120
Kind Code:
A1
Abstract:
A heat-bondable paper sheet (1) which is appropriate for backing of paper to be used for sliding door, shoji (paper sliding door), wall, and ceiling in a Japanese style house, for writing and drawing, or for plywood, and which can be heat-bonded by the use of heat of an iron. A heat-shrinkable and pressure-sensitive thermoplastic adhesive layer (3) is provided on one side of a sheet (2) roughened by crepe or emboss finishing or the like. Regardless of slight roughness of the surface of a ground sheet to which the heat-bondable sheet is bonded, the heat-sensitive adhesive layer (3) is easily melted with heat and enables bonding without causing creases when the sheet is lightly pressed, whereby bonding with the use of a steam iron which has been impossible up to now is made possible.

Inventors:
NAKAMURA YASUROU (JP)
Application Number:
PCT/JP1990/000992
Publication Date:
February 21, 1991
Filing Date:
August 02, 1990
Export Citation:
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Assignee:
NAKAMURA SEISHISHO KK (JP)
International Classes:
C09J7/21; C09J7/35; D21H13/10; D21H19/20; D21H19/24; D21H19/74; D21H27/00; D21H27/30; D21H27/36; D21H27/40; (IPC1-7): C09J7/04; D21H19/20; D21H19/24; D21H19/74; D21H27/36; D21H27/40
Foreign References:
JPS53119313A1978-10-18
JPS504029B11975-02-13
JPS5445417Y21979-12-26
JPS3814404Y11963-07-15
JPS3615781Y11961-06-15
JPS54135221A1979-10-20
Other References:
See also references of EP 0486690A4
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