HEAT-CAULKING DEVICE - HONDA MOTOR CO LTD

Title:

HEAT-CAULKING DEVICE

Document Type and Number:

WIPO Patent Application WO/2018/181910

Kind Code:

A1

Abstract:

This heat-caulking device (10) is inserted into one or more holes (22) penetrating a main plate (14) having a substantially conical hollow portion (12), whereby one or more bosses (24) of a blade (16) protruding from an inner peripheral surface (14a) of the main plate (14) toward the hollow portion (12) are melted so as to join the main plate (14) and the blade (16). A heat chip (34) of the heat-caulking device (10) has a substantially conical hollow main body portion (44), an outer peripheral surface (44a) of which conforms to the inner peripheral surface (14a) of the main plate (14). On the outer peripheral surface (44a) of the main body portion (44), a convex portion (52) protruding toward the vicinity of the holes (22) of the inner peripheral surface (14a) of the main plate (14) is provided.

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Inventors:

ISHIKAWA HIROSHI (JP)
TSURUGAI YOSHINORI (JP)
TAJIRI YUICHI (JP)
AKAHORI SHIGETO (JP)
OHTSU NAOHIRO (JP)
SHIOZAKI SATOSHI (JP)
URUSHIDANI SHINZO (JP)

Application Number:

PCT/JP2018/013649

Publication Date:

October 04, 2018

Filing Date:

March 30, 2018

Export Citation:

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Assignee:

HONDA MOTOR CO LTD (JP)

International Classes:

B29C65/56; B29C65/02

Domestic Patent References:

WO2017047786A1

2017-03-23

Foreign References:

JP2008132682A

2008-06-12

Attorney, Agent or Firm:

CHIBA Yoshihiro et al. (JP)

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