Title:
HEAT-CONDUCTING ASSEMBLY AND TERMINAL
Document Type and Number:
WIPO Patent Application WO/2019/184674
Kind Code:
A1
Abstract:
The present application relates to the technical field of electronics. Disclosed are a heat-conducting assembly and a terminal. The heat-conducting assembly comprises: a middle frame and a heat-conducting structure. The middle frame is plate-like, has a first side surface and a second side surface opposite to each other, and is provided with a first through hole enabling the first side surface to communicate with the second side surface. The heat-conducting structure comprises a heat-dissipation part and a conduction part. The heat-dissipation part is fixed on the second side surface. The conduction part extends into the first through hole. The heat conduction part comprises a conduction member and a heat-insulation member. The conduction member is connected to the heat-dissipation part, is fixed in the first through hole by means of the heat-insulation member, and is in contact with a heat source. The heat source is close to the end of the first through hole located on the first side surface. The present application solves the problem of how to dissipate the heat of a heat source. Therefore, the present application is used for heat dissipation of a heat source.
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Inventors:
SUN YONGFU (CN)
YANG GUO (CN)
LI QUANMING (CN)
YANG GUO (CN)
LI QUANMING (CN)
Application Number:
PCT/CN2019/077228
Publication Date:
October 03, 2019
Filing Date:
March 06, 2019
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K7/20; H04M1/02
Foreign References:
| CN2845416Y | 2006-12-06 | |||
| CN204131906U | 2015-01-28 | |||
| CN201904999U | 2011-07-20 | |||
| CN1755922A | 2006-04-05 | |||
| CN101861075A | 2010-10-13 | |||
| US6205025B1 | 2001-03-20 | |||
| CN106852067A | 2017-06-13 |
Other References:
See also references of EP 3764760A4
Attorney, Agent or Firm:
BEIJING SAN GAO YONG XIN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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