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Title:
HEAT-CONDUCTING LAMINATE FOR ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/147254
Kind Code:
A1
Abstract:
　A heat-conducting laminate for an electronic device in which double-sided adhesive tape is affixed to at least one surface of a foam sheet having a 25% compression strength of 200 kPa or less and a thickness of 0.05-1.0 mm, the base material of the double-sided adhesive tape being polyethylene terephthalate measuring 2-100 µm in thickness.

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Inventors:
KATO TETSUHIRO (JP)
SHIMONISHI KOJI (JP)
Application Number:
PCT/JP2015/059589
Publication Date:
October 01, 2015
Filing Date:
March 27, 2015
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
B32B27/36; B32B5/18; B32B27/00; C09J7/02; H01L23/373; H05K7/20
Foreign References:
JP2013227486A2013-11-07
JP2012052099A2012-03-15
JP2013014723A2013-01-24
JP2000150740A2000-05-30
JP2012129476A2012-07-05
Other References:
See also references of EP 3124241A4
Attorney, Agent or Firm:
OHTANI, Tamotsu (JP)
Tamotsu Otani (JP)
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