HEAT-CONDUCTING LAYER PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD

WIPO Patent Application WO/2021/060348

A1

Disclosed is a heat-conducting layer production method for producing, on a support, a heat-conducting layer having a thermal diffusivity of 3.0×10-7m2s-1 or higher by using a heat-conducting-layer-forming composition containing a resin, a filler, and a solvent and having a solid-content concentration of less than 90 mass%. The production method comprises: a discharging step for discharging the heat-conducting-layer-forming composition toward the support; and a solvent amount reducing step for reducing the amount of the solvent in the heat-conducting-layer-forming composition such that a first solvent amount reduction time is 10 seconds or longer at each position on the support, the first solvent amount reduction time being a time from when the heat-conducting-layer-forming composition is discharged to when the solid-content concentration in the heat-conducting-layer-forming composition reaches 90 mass% on the support. Also disclosed are a laminate production method and a semiconductor device production method applying said heat-conducting layer production method.

YAMASHITA KOSUKE (JP)
MURO NAOTSUGU (JP)
SAIE TOSHIYUKI (JP)
SATO NAOKI (JP)
SHIMADA KAZUTO (JP)

PCT/JP2020/035960

April 01, 2021

September 24, 2020

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FUJIFILM CORP (JP)

B05D7/00; B05D7/24; C09D201/00; H01L23/36; H01L23/373

JP2016207743A	2016-12-08
JP2013100477A	2013-05-23
JPH05259063A	1993-10-08
JP2010207788A	2010-09-24
JP2008253986A	2008-10-23
JP2019029269A	2019-02-21
JP2019114729A	2019-07-11
JP2013080916A	2013-05-02
JP2005272814A	2005-10-06

SIKs & Co. (JP)

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