Title:
HEAT-CONDUCTING MEMBER, HEAT-CONDUCTING COMPOSITION AND HEAT-CONDUCTING COMPOSITION PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2017/208341
Kind Code:
A1
Abstract:
Provided are: a heat-conducting composition having a high adhesive strength, when cured, toward an adherend such as a heat-dissipating body or a heat-generating body; and a heat-conducting member wherein the adherend and a cured product of the heat-conducting composition are integrated. The heat-conducting composition comprises a mixture containing an addition-reaction-type silicone, a heat-conducting filler whereof the proportion by volume of metal hydroxide is 80% by volume or greater, and a silane coupling agent having an acroyl group. The heat-conducting member 21 comprises the adherend 13 bonded to the cured body 12 of the composition.
Inventors:
ENDO HIROYA (JP)
Application Number:
PCT/JP2016/066023
Publication Date:
December 07, 2017
Filing Date:
May 31, 2016
Export Citation:
Assignee:
POLYMATECH JAPAN CO LTD (JP)
International Classes:
C08L83/04; B32B9/00; C08G77/04; C08K3/22; C08K5/5425; C09K5/14
Domestic Patent References:
| WO2011089987A1 | 2011-07-28 |
Foreign References:
| JP2005162975A | 2005-06-23 | |||
| JP2013127035A | 2013-06-27 | |||
| JP2013189498A | 2013-09-26 | |||
| JPH09316337A | 1997-12-09 | |||
| JP2011006600A | 2011-01-13 |
Other References:
See also references of EP 3467043A4
Attorney, Agent or Firm:
OHTAKE, Seigo (JP)
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