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Patent Searching and Data


Title:
HEAT-CONDUCTING MEMBER, HEAT-CONDUCTING COMPOSITION AND HEAT-CONDUCTING COMPOSITION PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2017/208341
Kind Code:
A1
Abstract:
Provided are: a heat-conducting composition having a high adhesive strength, when cured, toward an adherend such as a heat-dissipating body or a heat-generating body; and a heat-conducting member wherein the adherend and a cured product of the heat-conducting composition are integrated. The heat-conducting composition comprises a mixture containing an addition-reaction-type silicone, a heat-conducting filler whereof the proportion by volume of metal hydroxide is 80% by volume or greater, and a silane coupling agent having an acroyl group. The heat-conducting member 21 comprises the adherend 13 bonded to the cured body 12 of the composition.

Inventors:
ENDO, Hiroya (8-10-1, Tajima, Sakura-ku, Saitama-cit, Saitama 37, 〒3380837, JP)
Application Number:
JP2016/066023
Publication Date:
December 07, 2017
Filing Date:
May 31, 2016
Export Citation:
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Assignee:
POLYMATECH JAPAN CO.,LTD. (8-10-1, Tajima Sakura-ku, Saitama-cit, Saitama 37, 〒3380837, JP)
International Classes:
C08L83/04; B32B9/00; C08G77/04; C08K3/22; C08K5/5425; C09K5/14
Attorney, Agent or Firm:
OHTAKE, Seigo (Dai 4 Matsuzaka Bldg, 33-5 Higashiazabu 2-chome, Minato-k, Tokyo 44, 〒1060044, JP)
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