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Title:
HEAT CONDUCTING PROFILE
Document Type and Number:
WIPO Patent Application WO/2010/121283
Kind Code:
A3
Abstract:
The invention relates to a heat conducting profile, which comprises a heat conducting plate and at least one holding apparatus for a heat transfer pipe and can be held by means of a hook part. In the cross-sectional surface of the heat conducting profile (1, 11, 21), the connecting site of the heat conducting plate (1.1, 11.1, 21.1) to the profile rib (1.2) to which a heat transfer pipe (2) can be fastened is disposed at a distance from the pair of profile ribs (1.3, 11.3, 21.3) on which a hook part (3) can be hung. The side of the heat conducting plate (1.1, 11.1, 21.1) facing away from the profile ribs (1.3, 11.3, 21.3) is concavely curved in the profile view in the unloaded state. After creating the screw assembly with the cover plate, this results in excellent planar contact and thus achieves the best possible efficiency in terms of material usage and heat emission.

Inventors:
PEER, Robert (Mauerwaldgasse 9, Laab im Walde, A-2381, AT)
Application Number:
AT2010/000125
Publication Date:
November 17, 2011
Filing Date:
April 22, 2010
Export Citation:
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Assignee:
LINDNER GMBH (Auf der Haide 1, Baden, A-2500, AT)
PEER, Robert (Mauerwaldgasse 9, Laab im Walde, A-2381, AT)
International Classes:
F24D3/16
Domestic Patent References:
WO1997006389A11997-02-20
WO1992001847A21992-02-06
Foreign References:
DE1922977A11970-12-23
EP0939281A11999-09-01
DE29704570U11997-07-24
DE1946011A11971-03-25
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