Title:
HEAT-CONDUCTING SHEET, METHOD FOR MOUNTING HEAT-CONDUCTING SHEET, AND METHOD FOR PRODUCING ELECTRONIC EQUIPMENT
Document Type and Number:
WIPO Patent Application WO/2020/162164
Kind Code:
A1
Abstract:
Provided is a heat-conducting sheet which has improved usability and in which a release film can be easily peeled from a sheet body having a tacky sheet surface. The sheet has: a sheet body 2 having a tacky surface; a first release film 3 affixed to one surface 2a of the sheet body 2; and a second release film 4 affixed to the other surface 2b of the sheet body 2 on the side opposite the one surface 2a. The first release film 3 and the second release film 4 have different peel strengths from the sheet body 2.
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Inventors:
KUBO YUSUKE (JP)
MIYAZAKI YOSHIKAZU (JP)
ARAMAKI KEISUKE (JP)
MIYAZAKI YOSHIKAZU (JP)
ARAMAKI KEISUKE (JP)
Application Number:
PCT/JP2020/001962
Publication Date:
August 13, 2020
Filing Date:
January 21, 2020
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
C09J11/04; C09J183/04; H01L23/36; H05K7/20
Domestic Patent References:
| WO2017065113A1 | 2017-04-20 | |||
| WO2008053843A1 | 2008-05-08 |
Foreign References:
| JP2007254527A | 2007-10-04 | |||
| JP2002348554A | 2002-12-04 |
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro (JP)
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