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Title:
HEAT CONDUCTION ASSEMBLY, HEAT CONDUCTION DEVICE, AND PREPARATION METHOD FOR HEAT CONDUCTION ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2018/177443
Kind Code:
A1
Abstract:
A heat conduction assembly (100) and a heat conduction device provided with the same. The heat conduction assembly (100) comprises a housing (1), a plate (14), and a fin (3). A cavity is formed in the housing (1), and a heat exchange medium is filled in the cavity. The plate (14) is disposed in the cavity and divides the cavity into multiple sub cavities (2) that are separated from each other. The fin (3) is disposed in at least one sub cavity (2) and divides the at least one sub cavity (3) into multiple subchannels (21). The fin (3) is disposed in the cavity to form a capillarity phenomenon when the heat exchange medium flows in the cavity. By arranging the fin (3) in the cavity, the heat exchange medium can form the capillarity phenomenon along the fin (3) when the heat exchange medium flows in the cavity, thereby improving the heat exchange efficiency and the temperature equilibrium effect of the heat conduction assembly (100).

Inventors:
CUI KAI (CN)
LI TIANLONG (CN)
FENG RULU (CN)
Application Number:
CN2018/086870
Publication Date:
October 04, 2018
Filing Date:
May 15, 2018
Export Citation:
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Assignee:
HANGZHOU SANHUA HOME APPLIANCE THERMAL MAN SYSTEM CO LTD (310018, CN)
International Classes:
F28F1/06; F28D15/04
Foreign References:
CN206832101U2018-01-02
CN203069032U2013-07-17
CN101363696A2009-02-11
CN105423789A2016-03-23
CN105333758A2016-02-17
JP2011047542A2011-03-10
CN101493296A2009-07-29
Attorney, Agent or Firm:
TSINGYIHUA INTELLECTUAL PROPERTY LLC (100084, CN)
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