Title:
HEAT CONDUCTION MEASURING DEVICE AND HEAT CONDUCTION MEASURING METHOD
Document Type and Number:
WIPO Patent Application WO/2010/103784
Kind Code:
A1
Abstract:
A heat conduction measuring device (10) having an upper rod (23) connected thermally with a heating source, a lower rod (25) connected thermally with a cooling source, a sample block (24a) coupled thermally with the upper rod (23), and a sample block (24b) coupled thermally with the lower rod (25), is further provided with a cartridge (24) which sandwiches a sample (W) between the sample blocks (24a, 24b), temperature sensors (45, 46) which measure the temperature of the sample blocks (24a, 24b), a temperature operating unit (66) which derives the temperature gradient of the upper rod (23) and the temperature gradient of the lower rod (25) and derives the temperature difference between the sample blocks (24a, 24b) from the temperature measured in the temperature sensors (45, 46), and a physical property value deriving unit (67) which derives the physical property value related to heat conduction of the sample (W) based on the results of the operation by the temperature operating unit (66).
More Like This:
Inventors:
OGUSHI TETSURO (JP)
NAKAGAWA YASUTOSHI (JP)
HIRATA TAKUYA (JP)
TANAKA HIROKAZU (JP)
NAKAGAWA YASUTOSHI (JP)
HIRATA TAKUYA (JP)
TANAKA HIROKAZU (JP)
Application Number:
PCT/JP2010/001610
Publication Date:
September 16, 2010
Filing Date:
March 08, 2010
Export Citation:
Assignee:
JOSHO GAKUEN EDUCATIONAL FOUND (JP)
ESPEC CORP (JP)
OGUSHI TETSURO (JP)
NAKAGAWA YASUTOSHI (JP)
HIRATA TAKUYA (JP)
TANAKA HIROKAZU (JP)
ESPEC CORP (JP)
OGUSHI TETSURO (JP)
NAKAGAWA YASUTOSHI (JP)
HIRATA TAKUYA (JP)
TANAKA HIROKAZU (JP)
International Classes:
G01N25/18
Foreign References:
| JP3858660B2 | 2006-12-20 | |||
| JP2006145446A | 2006-06-08 | |||
| JP2000055846A | 2000-02-25 | |||
| JP3858660B2 | 2006-12-20 |
Other References:
CHIBA H. ET AL.: "Steady state comparative- longitudinal heat flow method using specimen of different thicknesses for measuring thermal conductivity of lotus-type porous metals", J APPL PHYS, vol. 103, no. 1, 2008, pages 013515, XP012108599
"National Heat Transfer Symposium of Japan Koen Ronbunshu(CD-ROM), 2007", vol. 44, article HIROSHI CHIBA ET AL.: "Ichi Hoko Netsuryu Teijo Hikakuho (Shikenhen Atsusa Henkaho) ni yoru Netsu Dendoritsu Sokuteiho no Kento", pages: C211, XP008166708
"The Japan Society of Mechanical Engineers Proceedings of Thermal Engineering Conference, 06 November 2009 (06.11. 2009)", vol. 2009, 6 November 2009, article TAKUYA HIRATA ET AL.: "Dodensei Secchakuzai Netsudendoritsu Sokutei Sochi no Kaihatsu -Cartridge Hoshiki Ichi Hoko Netsuryu Teijo Hikakuho", pages: 169 - 170, XP001526269
"National Heat Transfer Symposium of Japan Koen Ronbunshu(CD-ROM), 2007", vol. 44, article HIROSHI CHIBA ET AL.: "Ichi Hoko Netsuryu Teijo Hikakuho (Shikenhen Atsusa Henkaho) ni yoru Netsu Dendoritsu Sokuteiho no Kento", pages: C211, XP008166708
"The Japan Society of Mechanical Engineers Proceedings of Thermal Engineering Conference, 06 November 2009 (06.11. 2009)", vol. 2009, 6 November 2009, article TAKUYA HIRATA ET AL.: "Dodensei Secchakuzai Netsudendoritsu Sokutei Sochi no Kaihatsu -Cartridge Hoshiki Ichi Hoko Netsuryu Teijo Hikakuho", pages: 169 - 170, XP001526269
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
Etsuji Kotani (JP)
Etsuji Kotani (JP)
Download PDF: